ASUS ROG-STRIX-B760-G-GAMING-WIFI-D4

Go big and stay compact. The ROG Strix B760-G D4 pairs perfectly with the Prime AP201 and the latest crop of compact chassis driving the m-ATX renaissance. Stout heatsinks and amped power delivery ensure ample headroom to propel Intel® 13th Gen Core processors, while a PCIe 5.0 SafeSlot welcomes high-performance graphics cards for gaming at 4K and beyond. Blisteringly-fast USB Type-C® and WiFi 6 connectivity further emphasize readiness for things to come. And the black, white, and silver colorway and customizable lighting combine to put endless build themes at your disposal.

PCIE® SLOT Q-RELEASE

A physical button unlocks the first PCIe slot's security latch with one press, greatly simplifying the process of detaching a PCIe card from the motherboard when it's time to upgrade to a new GPU or other compatible device.

M.2 Q-LATCH

The innovative Q-Latch makes it easy to install or remove an M.2 SSD without the need for specific tools. The design employs a simple locking mechanism to secure the drive and neatly eliminate traditional screws.

BIOS FLASHBACK™

BIOS FlashBack™ is a safe and simple way to update BIOS. Just drop the (UEFI) BIOS file onto a FAT32-formatted USB stick, plug it into the USB BIOS FlashBack port, and press the button. Updates can even be performed without having memory or a CPU installed.

Q-LED

Four onboard LEDs indicate power status and identify problems with CPU, memory, graphics card, or boot device for quick diagnosis.

ALL-ROUND PERFORMANCE

Well-placed and optimized heatsinks cover the VRM and M.2 slots to keep performance pushed to the max, even in cramped quarters.

TEAMED POWER ARCHITECTURE

12 + 1 power stages each rated to 60A deliver ample current to drive the most powerful Intel 13th Gen processors through any workload with ease.

ALLOY CHOKES AND DURABLE CAPACITORS

High-end chokes and durable capacitors are engineered to resist extreme temperatures, enabling performance that exceeds industry standards.

SIX-LAYER PCB

A multi-layered printed circuit board design quickly dissipates heat around the voltage regulators to improve overall system stability.

OPTIMEM II

OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce path distance, and it adds shielding zones that significantly reduce crosstalk.

Covering the power solution are two thick heatsinks with strategic airflow channels for increased heat dissipation while powering high-performance Intel 13th Gen processors.

M.2 HEATSINKS

Heatsinks cover both M.2 slots to help keep onboard NVME SSDs at optimal temperatures for consistent performance and reliability.